Electrolytic gold plating method and apparatus therefor
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United States of America Patent
Stats
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Jun 8, 2004
Grant Date -
May 22, 2003
app pub date -
Nov 21, 2001
filing date -
Nov 21, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously detecting a deterioration state of the gold sulfite complex plating solution, and to provide an apparatus for monitoring the deterioration of the electrolytic gold plating solution. The present invention is characterized by an electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, wherein the gold plating is performed while deterioration of the plating solution is being always or intermittently detected during plating. Further, the present invention is characterized by an electrolytic gold plating apparatus for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, which comprises a detecting means for always or intermittently detecting deterioration of the plating solution and a monitoring unit for displaying the deterioration degree.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
HITACHI KYOWA ENGINEERING CO LTD | IBARAKI |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Kadota, Hiroyuki | Hitachi, JP | 1 | 0 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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