Methods and compositions for oxide production on copper

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United States of America Patent

PATENT NO 6746547
APP PUB NO 20030168128A1
SERIAL NO

10093097

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention features and methods and compositions for oxide production on a Copper substrate, e.g., a Copper or Copper alloy substrate, to provide for improved adhesion of Copper substrate to polymeric material, e.g., such as used in manufacture of printed circuit boards. The oxide-producing compositions of the invention, which may be either acidic or ammoniacal, comprise 1) a source of Cu.sup.++ (Cupric) ions; 2) a source of a primary electrolyte that is non-interactive with Copper ions; 3) a Cuprous ligand, e.g., a halide ion, preferably chloride, which also serves as a secondary electrolyte; and 4) an optional organic. Acidic oxide-producing compositions comprise a strong acid as the primary electrolyte. The primary electrolyte of ammoniacal oxide-producing compositions is a non-interactive, ammonium salt of acid, which provides a highly soluble Cupric ammonium salt. The secondary electrolyte of the oxide-producing compositions is selected so as to be compatible with the primary electrolyte.

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Patent Owner(s)

Patent OwnerAddress
RBP CHEMICAL TECHNOLOGY INC150 S 118TH STREET MILWAUKEE WI 53214

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cole, Joseph Redwood City, CA 15 364
Sedlak, Rudolf P Mountain View, CA 5 77

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