Polyimide film
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United States of America Patent
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Jun 1, 2004
Grant Date -
Mar 21, 2002
app pub date -
Sep 25, 2001
filing date -
Apr 18, 1995
priority date (Note) -
Expired
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Abstract
A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5'-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
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