Substrate processing device, substrate conveying device, and substrate processing method

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United States of America Patent

PATENT NO 6742977
SERIAL NO

09503916

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An unprocessed substrate is conveyed to a film-processing chamber at the same time a processed substrate is conveyed to a substrate preparation chamber, reducing the substrate processing cycle, thereby increasing the yield per unit time. The substrate preparation chamber has a two-tiered structure for receiving processed substrates and unprocessed substrates. A two-tiered transfer robot allows the substrates to be removed or placed into the preparation and process chambers at the same time, thus decreasing the cycle time for processing a substrate.

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Patent Owner(s)

Patent OwnerAddress
KOKUSAI ELECTRIC CO LTDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akao, Tokunobu Tokyo, JP 24 685
Akita, Yukio Tokyo, JP 5 65
Ichimura, Satoru Tokyo, JP 4 180
Ishida, Takeshige Tokyo, JP 1 34
Kanazawa, Motoichi Tokyo, JP 2 42
Nakayama, Yasunobu Tokyo, JP 11 348
Okayama, Satohiro Tokyo, JP 16 443
Suzuki, Kazunori Tokyo, JP 86 987
Takeda, Tomohiko Tokyo, JP 11 94
Yoshino, Teruo Tokyo, JP 36 1214

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