Gas injection type soldering method and apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6742702
APP PUB NO 20030127498A1
SERIAL NO

10036400

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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After a reducing gas is mixed with an inert gas by a mixer, a resultant mixed gas is heated by a heater and made to a hot mixed gas which is dehumidified and dried and the temperature of which is increased. The mixed gas is injected to a subject from an injection port formed in a soldering iron, and thereby soldering is performed by heating and melting solder with the soldering iron in the atmosphere of the mixed gas.

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Patent Owner(s)

Patent OwnerAddress
JAPAN UNIX CO LTD12-12 AKASAKA 2-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Shigeru Tokyo, JP 58 648

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