Wafer space supporting apparatus installed on electrostatic chuck and method for fabricating the same
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United States of America Patent
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May 25, 2004
Grant Date -
Dec 5, 2002
app pub date -
Jan 14, 2002
filing date -
May 29, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A wafer space supporting apparatus is installed on a support chuck to relieve physical stress caused by thermal expansion or contraction of an object to be fabricated and adjusts itself to support the object to compensate for thermal expansion and contraction as well as minimize hard defects generated. The wafer space supporting apparatus includes a plurality of sliding pockets sunken into the supporting surface of the chuck, and sliding pads respectively floating-coupled in the sliding pockets such that they are spaced apart from the supporting surface so that they may adapt to expansions and contractions of an object to be fabricated, thereby preventing or minimizing any hard defects or physical stress.
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