Method of determining one or more properties of a semiconductor wafer
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United States of America Patent
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May 25, 2004
Grant Date -
Dec 5, 2002
app pub date -
Mar 18, 2002
filing date -
Oct 19, 2000
priority date (Note) -
Expired
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Abstract
A product semiconductor wafer has integrated circuits separated by scribe lines. A probe having an elastically deformable, electrically conductive tip is moved into contact with one of the scribe lines thereby forming a test structure. A suitable electrical stimulus is applied to the test structure and a response of the test structure to the electrical stimulus is measured. At least one property of the product semiconductor wafer is determined from the response.
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