Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate
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United States of America Patent
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May 25, 2004
Issued Date -
N/A
app pub date -
Oct 30, 2002
filing date -
May 10, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
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