Processes for manufacturing flexible wiring boards and the resulting flexible wiring board
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United States of America Patent
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May 18, 2004
Grant Date -
N/A
app pub date -
Aug 18, 2000
filing date -
Aug 26, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Against a first resin film formed on a first metal film are pressed bumps on a second metal film so that the bumps are embedded into the first resin film. Either one of the first metal film or the second metal film or both is (are) patterned while the bumps are in contact with the first metal film, and the first resin film is heat-treated while the top of the first resin film is partially exposed to discharge the solvent or moisture from the exposed zone, and cure the first resin film. After curing, the bumps and the first metal film may be ultrasonically bonded to each other. A second resin film and a third metal film may be further layered to form a multilayer structure.
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