Wafer plating apparatus
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United States of America Patent
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-
May 18, 2004
Grant Date -
Aug 30, 2001
app pub date -
Feb 26, 2001
filing date -
Feb 28, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wafer plating apparatus includes a wafer clamp for holding a wafer, a wafer support member for supporting the peripheral edge of the surface to be plated, and a plating tank which circulates a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged to perform plating, while the surface to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer is clamped by the wafer clamp and the wafer support member. The wafer support member is equipped with air-vent grooves for discharging the air which remains on the peripheral edge of the surface to be plated while the surface of the plating solution and the wafer make contact. The air-vent grooves are formed at the lower end of the wafer support portion.
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