Multiple leadframe laminated IC package
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United States of America Patent
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May 11, 2004
Grant Date -
N/A
app pub date -
Jun 10, 2002
filing date -
Jun 10, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.
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