Thermoelectric module and process for producing thermoelectric module
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United States of America Patent
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Apr 27, 2004
Grant Date -
May 23, 2002
app pub date -
Sep 28, 2001
filing date -
Sep 29, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermoelectric module includes a case, a insulating base plate for a exoergic side, a insulating base plate for endoergic side, a first soldering layer which joins the insulating base plate for the exoergic side to the case via a first soldering material, and a second soldering layer which joins P-type and N-type semiconductor tips to the insulating base plate for an exoenergic side and a insulating base plate for an endoergic side, using second soldering material. The melting point temperature of the first soldering material for the first soldering layer is higher than the melting point temperature of the second material for the second soldering layer.
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