Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
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United States of America Patent
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Apr 27, 2004
Grant Date -
N/A
app pub date -
May 23, 2001
filing date -
Nov 28, 1998
priority date (Note) -
Expired
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Abstract
A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.
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