Reservoir stencil with relief areas and method of using
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United States of America Patent
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Apr 20, 2004
Grant Date -
Apr 3, 2003
app pub date -
Feb 14, 2002
filing date -
Sep 28, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A stencil comprising two or more layers is disclosed for applying surface mount materials onto printed circuit boards, flexible circuits, wafers or other substrates. The stencil can accommodate preexisting surface mount components and materials. The stencil utilizes material reservoirs, relief areas and delivery apertures and can be used for depositing surface mount materials such as adhesives, conductive glues, solder paste and solder balls.
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