Method and apparatus for evaluating insulating film
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United States of America Patent
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Apr 13, 2004
Issued Date -
N/A
app pub date -
Mar 12, 2003
filing date -
Mar 17, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is provided a method for evaluating an insulating film entirely provided on a conductor layer for the characteristics or dimensions thereof. A measuring member having conductor bumps arranged thereon to be connected to wires is disposed above the insulating film on the conductor layer. Then, the conductor bumps are pressed against the insulating film with a given pressing force. By applying a voltage (electric stress) between the conductor bumps and the conductor layer, the characteristics including I-V characteristic, gate leakage current, and TDDB or the dimensions including thickness are evaluated.
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