Method and apparatus to form dimensionally consistent orifices and chamfers by laser using spatial filters
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United States of America Patent
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Apr 13, 2004
Grant Date -
Feb 6, 2003
app pub date -
Oct 9, 2001
filing date -
Jul 31, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval during the first time interval. The apparatus includes at least one source of collimated and non-collimated light, various spatial filters that can be used with the laser light source, a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.05 micron and approximately 0.13 micron and a coefficient ratio of at least approximately 0.
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