System and method for microstructure positioning using metal yielding
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United States of America Patent
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Apr 13, 2004
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app pub date -
Jun 28, 2002
filing date -
Jun 28, 2002
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Abstract
A system and method of adjusting the power off positioning of a microactuator is disclosed. The microactuator has a first power off position and comprises a bimorph component. The bimorph comprises at least two materials, wherein the materials have different thermal expansion characteristics. When heated, the bimorph component of the microactuator bends due to asymmetric thermal expansion of the materials. If one of said materials is forced beyond a yield point, then when cooled, the actuator assumes a second power off position. The microactuator maintains the second power off position due to stress in the bimorph, which is induced by forcing the material beyond its yield point.
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