Ethylene (co) polymers, and laminate and hollow molding made by using the same

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United States of America Patent

PATENT NO 6716385
APP PUB NO 20030054126A1
SERIAL NO

10162767

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Abstract

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Ethylene (co)polymers each having specified values of (a) density, (b) molecular weight distribution (Mw/Mn), (c) relationship between die swell (DS) and shear rate (.gamma.) in a region of shear rate (.gamma.), (d) relationship between stress (.sigma.) and maximum stress (.sigma. max) in a stress-strain curve in uniaxial stretching, (e) the ratio of sample diameter to initial sample diameter and the time for sample breakage during uniaxial stretching under a constant tension, blow molding process in which the thickness of a parison is adjusted by using the said ethylene (co)polymer, and the method of improving fire resistance in moldings, laminates and hollow moldings made by using the same. The ethylene (co)polymers are excellent in drawdown resistance, puncture resistance, parison control response, pinch-off properties, durability, and fire resistance, by using it, parison thickness can be controlled freely in blow molding, and large blow moldings having complicated shapes excellent in durability and fire resistance can be obtained.

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Patent Owner(s)

Patent OwnerAddress
JAPAN POLYOLEFINS CO LTD26-5 TORANOMON 1-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kanazawa, Satoshi Kanagawa, JP 20 192
Kondou, Haruhiko Ohita, JP 1 1
Ogawa, Koichi Kanagawa, JP 110 2014
Tabuchi, Daizo Kanagawa, JP 1 1
Takahashi, Kei Ohita, JP 407 3896

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