Method and device for thermally connecting the contact surfaces of two substrates
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United States of America Patent
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Mar 30, 2004
Grant Date -
N/A
app pub date -
Jul 17, 2001
filing date -
Jan 18, 1999
priority date (Note) -
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Abstract
A method and a device for thermally connecting the terminal areas (26, 27) of a contact substrate (11) to the terminal areas (28, 29) of a carrier substrate (12), where the substrates (11, 12) are, in order to produce the connection, arranged in a connecting position such that the terminal areas (26, 28; 27, 29) are situated opposite one another in the plane of the connection, where the contact substrate (11) is heated to the connecting temperature from its rear side that is situated opposite the terminal areas (26, 27) in order to reach the required connecting temperature in the plane of the connection, and where the contact substrate (11) is heated by subjecting the substrate to laser energy.
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