Compliant fibrous thermal interface
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United States of America Patent
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Mar 30, 2004
Grant Date -
N/A
app pub date -
Jun 21, 1999
filing date -
Jun 24, 1998
priority date (Note) -
Expired
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Abstract
Described is a fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers that extend out of the adhesive and beneath the free tips of the fibers.
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