CPU cooling structure
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United States of America Patent
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-
Mar 30, 2004
Grant Date -
Jan 1, 2004
app pub date -
Jul 1, 2002
filing date -
Jul 1, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A CPU cooling structure is constructed to include a heat sink adapted for mounting on a motherboard to absorb heat from a CPU of the motherboard, a fan provided above the heat sink and adapted for causing currents of air toward the heat sink to carry heat away from the heat sink, and a flow guide mounted on the heat sink to hold the fan above the heat sink, the flow guide having two flow guide holes and an air damper suspended in between the flow guide holes and adapted for guiding air from the fan toward the center area of the heat sink for enabling air to flow through air passages in the heat sink in reversed directions to carry heat away from the heat sink.
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