Liquid metal socket system and method
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United States of America Patent
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-
Mar 23, 2004
Grant Date -
N/A
app pub date -
Apr 18, 2002
filing date -
Apr 18, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A liquid metal socket test fixture system and a method for the same are provided. The system has a circuit board top surface and a plurality of wells. A liquid metal compound forms balls in the wells. An IC package having a bottom surface with electrical contacts interfaces with the liquid metal compound in the wells. In some aspects of the system, the IC package has solid ball grid array (BGA) connectors attached to the bottom surface electrical contacts, interfacing with the liquid metal compound. Alternately, the liquid metal compound interfaces directly to the IC package bottom surface contacts. A gravity-tension frame overlies the circuit board top surface. The frame provides support in the horizontal plane so that the liquid metal balls remain aligned with the IC package electrical contacts. Typically, the liquid metal compound is a mixture of approximately 24% indium and 76% gallium.
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