Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate
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United States of America Patent
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Mar 23, 2004
Issued Date -
N/A
app pub date -
Sep 3, 1998
filing date -
Jun 6, 1995
priority date (Note) -
Expired
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Abstract
A method of controlling shrinkage in aligned green tape stacks during firing comprises providing a topmost layer of a ceramic material having a sintering temperature higher than that of the ceramic used to make the green tapes and firing above the sintering temperature of the green tape ceramic but below the sintering temperature of the topmost layer ceramic. The method of the invention provides improved shrinkage control for green tape stacks on a support substrate.
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