Package of semiconductor chip with array-type bonding pads
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 16, 2004
Grant Date -
Apr 24, 2003
app pub date -
May 10, 2002
filing date -
Oct 19, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package of a semiconductor chip with array-type bonding pads. The semiconductor chip has a plurality of bonding pads located about periphery of the chip, in which the semiconductor chip is characterized at the bonding pads being positioned in at least four rows along each side of the chip, the four rows comprising an inner row, a mid-inner row, a mid-outer row, and an outer row. The inner row and the mid-inner row of the bonding pads consist of signal pads, and the outer row and the mid-outer row of the bonding pads consist of power pads and ground pads.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully