Electronic assembly comprising a sole plate forming a heat sink
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United States of America Patent
Stats
-
Mar 16, 2004
Grant Date -
N/A
app pub date -
Jun 25, 2001
filing date -
Jul 23, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention concerns an assembly supported on a base plate forming a radiator or capable of being directly mounted on the base plate, comprising a printed circuit card (1) having its thickness a plurality of holes (5) ensuring heat transfer between one face of said printed circuit card (1), which bears one or several electronic components (2) each enclosed by a box, and a base plate (3). The base plate forms a radiator having a plurality of pads (4a) made of heat conducting material and which run through the printed circuit card (1) over substantially its whole thickness to ensure heat transfer between a face of the printed circuit card (1) and the base plate. The pads (4a) are integral with a sole plate (4) which bears them. The sole plate (4) is interposed between the printed circuit card (1) and the base plate.
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