Ceramic heat sink with micro-pores structure
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United States of America Patent
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Mar 16, 2004
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N/A
app pub date -
Feb 25, 2003
filing date -
Feb 25, 2003
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Abstract
A ceramic heat sink having a micro-pores structure includes a heat dissipation layer, and a thermal conductive layer. The heat dissipation layer forms a ceramic micro-cell structure, which is combined with a sub-micrometer powder, thereby forming the heat dissipation layer. The thermal conductive layer is mounted on the heat dissipation layer to contact with a heat source. Thus, the thermal conductive layer absorbs the heat energy from the heat source; the heat dissipation layer has a micro-pores structure with hollow crystals, and the air functions as the media of heat dissipation, so that the heat dissipation capacity of the ceramic heat sink is greatly enhanced.
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