Power feed and heat dissipating device for power semiconductor devices
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United States of America Patent
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-
Mar 9, 2004
Grant Date -
Mar 13, 2003
app pub date -
Oct 29, 2001
filing date -
Jun 3, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In an electric circuit using a plurality of power semiconductor devices 1, the power semiconductor devices have heat radiation metallic parts 5 to which the electrodes in the power semiconductor devices are electrically connected within a package of the semiconductors. Among the plurality of power semiconductor devices, the heat radiation metallic parts of those having electrodes of the same potential connected to the heat radiation metallic parts are conductively fixed to a single radiator 6 having conductivity. Thus, the radiators are used as a single connection terminal. Besides, the plurality of radiators are conductively fixed to a single heat radiating plate 7 having conductivity, and the heat radiating plate is used as a single connection terminal, or the radiator is electrically insulated and fixed to another radiator 11.
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