Bonding structure for a hard disk drive suspension using anisotropic conductive film
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United States of America Patent
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Mar 9, 2004
Grant Date -
N/A
app pub date -
Oct 25, 2000
filing date -
Oct 25, 2000
priority date (Note) -
Expired
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Abstract
A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anisotropic bonding to ensure durable bonding. At the same time, these structures also allow for reworkability under which the bonded parts can be separated easily.
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