Method of forming a conductive pattern on a circuit board
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United States of America Patent
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Mar 9, 2004
Grant Date -
N/A
app pub date -
Aug 10, 2000
filing date -
Aug 11, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of forming a conductive circuit pattern on a circuit board having a first region, on which a desired conductive circuit pattern is to be formed, and a second region. The method includes the step of applying a coating including a solution with conductive particles to the circuit board. The coating is heated to adhere the conductive particles to the circuit board. The conductive particles are removed in the second region. The second region is shielded and, with the second region shielded, a conductive film is formed on the first region.
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