Wafer polishing apparatus utilizing an Oldham's coupling mechanism for the wafer carrier
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United States of America Patent
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-
Mar 9, 2004
Grant Date -
Jun 6, 2002
app pub date -
Nov 30, 2001
filing date -
Dec 4, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A rotation force of a drive shaft is transmitted from a drive plate to an intermediate plate through a first pin, and a rotation force of the intermediate plate is transmitted to a carrier through a second pin. The rotation force of the drive shaft is transmitted to the carrier through an Oldham's coupling mechanism; thereby, a wafer polishing apparatus can always rotate the carrier in a stable condition even though a wafer receives a friction force in side directions from a polishing pad because no twisting force is applied to the drive shaft.
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