Molded emblem with encapsulated embossed 3-D graphics
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United States of America Patent
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-
Mar 9, 2004
Grant Date -
N/A
app pub date -
Oct 22, 2001
filing date -
Oct 22, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An emblem (20, 20a, 20b) with encapsulated embossed 3-D graphics is provided by a substrate (22) having a first side (24) and an opposite second side (26), an ink pattern (28) printed on the second side and providing embossed 3-D graphics, and a transparent layer (30) molded on the first side and through which the graphics are viewable. The substrate is softer than the ink pattern and deforms therearound during molding of the transparent layer, to provide differing depths. A mold (36, 38) has a smooth nonembossed surface (42) engaging the second side of the substrate without a 3-D mold-insert.
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Cited Art Landscape
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