Stamper manufacturing method
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United States of America Patent
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-
Mar 2, 2004
Grant Date -
Apr 4, 2002
app pub date -
Sep 24, 2001
filing date -
Sep 25, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
It is an object to provide a stamper manufacturing method capable of shortening a time taken for manufacturing a stamper without requiring special equipment such as a dry etching device. The stamper manufacturing method comprises the steps of forming a photoresist layer (6) on one of surfaces of a conductive substrate (1), exposing a desirable portion of the photoresist layer (6), developing the photoresist layer (6), forming an electroforming body (8) on the substrate (1) in a portion from which the photoresist layer (6) is removed at the developing step, and carrying out washing to remove the photoresist layer (6) from the substrate (1).
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