Device and method for transferring microstructures
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United States of America Patent
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Mar 2, 2004
Grant Date -
N/A
app pub date -
May 9, 2001
filing date -
May 27, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device and a method for transferring microstructures from a tool to a substrate which is to be structured. The device and method are intended to align the tool and the substrate in a mutually controlled manner. The device contains supports for the tool and the substrate which can be displaced in an opposing direction in relation to one another, resulting in an alteration of the distance between the tool and the substrate. A measuring system is provided which can be inserted between the supports, for measuring selected locations on at least one measuring plane. The direction of displacement of the supports is aligned vertically in relation to said measuring plane. The measuring system forms a fixed spatial relationship with the tool in a measuring position. The substrate can be aligned in relation to the tool. The method and device can be used for producing microstructured components.
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