Laser soldering method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 24, 2004
Grant Date -
Dec 27, 2001
app pub date -
Apr 12, 2001
filing date -
Jun 26, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.
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