Magnetron sputter source with multipart target
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United States of America Patent
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Feb 17, 2004
Grant Date -
Nov 7, 2002
app pub date -
Apr 29, 2002
filing date -
May 3, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device and method has a magnetron sputter source with a multipart target (3, 4) and movable magnet system (5). By variation of the power delivery of the power supply (6), specific areas of the multipart target (3, 4) can be preferably affected, which permits setting the stoichiometry of the sputtered-off target materials on the substrate (15) to be covered and positively affecting the homogeneity of the layer structure.
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