Dual module RWW tape head assembly
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United States of America Patent
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Feb 10, 2004
Grant Date -
N/A
app pub date -
Nov 29, 2001
filing date -
Dec 13, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A tape head assembly for high-speed and high-density multi-channel read-while-writing (RWW) operation comprises two modules bonded together. The modules are initially formed on an integral unit and gapped in pair, to produce a good reference surface, which insures that the finished head assembly will meet tight azimuth and gap tolerances. The unit is then machined to two separate the modules. Further processing involves individually machining the head surface of each module to achieve desired contours. The machined modules are tested and brought together in the positional arrangement required to form the final head assembly. In disclosed embodiments, the overall contour enables the assembly to skive air and debris off a surface of the magnetic tape before passage of the tape over the transducers. The contour allows the tape to fly over outriggers, but contacts regions at or around the transducers with a low constant contact pressure during RWW operation.
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