Substrate polishing device and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 10, 2004
Grant Date -
N/A
app pub date -
Aug 22, 2001
filing date -
Nov 29, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
To address the deficiencies of the prior art, the present invention provides a polishing pad comprising a thermoplastic polymer and a method of manufacturing therefor. More specifically, the present invention polishing pad fabricated from an extruded amorphous thermoplastic and free of a gate vestige. The invention also provides a method of manufacturing a polishing pad that is free from a gate vestige pad from an extruded amorphous thermoplastic.
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