Relay device
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United States of America Patent
Stats
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Feb 3, 2004
Grant Date -
Sep 12, 2002
app pub date -
Mar 12, 2002
filing date -
Mar 12, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A relay device capable of reducing the manufacturing costs thereof by decreasing the number of parts and the number of electrical connections between these parts, and making the manufacturing process simple. The relay device has a plurality of electromagnetic relays and uses a common base plate with which stems of the electromagnetic relays are formed integrally, and on which a wiring member is formed by resin molding. The wiring member on the common base plate is projected from the molded resin to define a fixed contact member of each electromagnetic relay. Each relay unit assembly of each electromagnetic relay except for the fixed contact member thereof is secured to the common base plate such that a movable iron piece is driven in parallel with a surface of the common base plate. The construction of the resultant relay device is compact, the relay properties are readily adjusted, and the number of parts can be reduced.

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ANDEN CO LTD | 1-10 SASAME-CHO ANJO-CITY AICHI-PREF 448-8503 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Suzuki, Hirohisa | Nishio, JP | 46 | 535 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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