Method for treating spent tin/lead stripping solution
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United States of America Patent
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Feb 3, 2004
Grant Date -
Oct 30, 2003
app pub date -
Apr 26, 2002
filing date -
Apr 26, 2002
priority date (Note) -
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Abstract
The present invention relates to a method for treating spent tin or tin/lead stripping solution used in the electronic industry, particularly in the manufacture of printed circuit boards or a lead frames. Said method comprises (i) electrolytically reducing copper ions in the solution to copper at a low temperature; (ii) electrolytically oxidizing Sn.sup.2+ and Pb.sup.2+ in the solution at a high temperature to form solid tin and lead oxides and hydroxides; (iii) separating solid tin and lead oxides and hydroxides from the solution; (iv) dissolving tin and lead oxides and hydroxides obtained in step (iii) in a strong alkali or acidic solution; and (v) electrolytically reducing the alkali or acidic solution obtained in step (iv) at a high temperature to recover metallic tin and lead. Also, the filtrate obtained in step (iii) above is useful for preparing fresh tin or tin/lead stripping solution.
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