Extruded heatsink and EMC enclosure
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United States of America Patent
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-
Jan 20, 2004
Grant Date -
Oct 2, 2003
app pub date -
Mar 29, 2002
filing date -
Mar 29, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component.
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