Method for applying a photoresist layer to a substrate having a preexisting topology
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United States of America Patent
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Jan 20, 2004
Grant Date -
Aug 14, 2003
app pub date -
Feb 12, 2002
filing date -
Feb 12, 2002
priority date (Note) -
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Abstract
The present invention describes a method for preventing a photoresist layer from delaminating, peeling, away from the surface of a substrate that already contains an etched three dimensional structure such as a hole or a trench. The process comprises establishing a saturated vapor phase of the solvent media used to formulate the photoresist layer, above the surface of the coated substrate as the applied photoresist is heated in order to 'cure' or drive off the retained solvent constituent within the layer. By controlling the rate and manner in which solvent is removed from the photoresist layer the layer is stabilized and kept from differentially shrinking and peeling away from the substrate.
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