Compound for producing electrodes and process for forming electrodes
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United States of America Patent
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Jan 20, 2004
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N/A
app pub date -
May 18, 2000
filing date -
May 21, 1999
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Abstract
The invention provides a novel compound of materials, which solves the problem of metal diffusion into glass layers during the formation of electrodes on a glass substrate. The invention provides a compound which comprises a powder of a conducting metal or alloy and a powder of a meltable metal or alloy. The use of a metal compound furthermore makes it possible to eliminate a firing step in the electrode formation process. Depending on various embodiments, the compound may furthermore include an adhesion promoter, in order to bond the electrodes to the substrate, a resin and/or a photosensitive substance. The invention also relates to a process for manufacturing a plasma panel using the said compound, and to a plasma panel obtained by the said process.
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