Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board
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United States of America Patent
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Jan 13, 2004
Grant Date -
Aug 8, 2002
app pub date -
Oct 17, 2001
filing date -
Oct 20, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The method for producing a solder bump transfer sheet of the invention includes the steps of: providing a sheet having a chromium oxide layer containing substantially no iron oxide as the outermost surface; and forming a plurality of solder bumps placed in a predetermined pattern on the chromium oxide layer.
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