Process for encapsulating an electrical or electronic component in a sealed manner
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United States of America Patent
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Jan 13, 2004
Issued Date -
N/A
app pub date -
Feb 5, 2002
filing date -
Mar 31, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electrical or electronic component with sealed encapsulation includes a support for housing one or more electrical or electronic components from which electrically conducting tracks radiate towards a periphery of the support. Also included is a protective and sealing casing attached to the support and hermetically sealed with respect to the latter by a peripheral metal bead. A main part of the casing is intended to be placed opposite the support which is provided with hollow conducting elements passing through the thickness of the casing. Electrically conducting metal tracks radiate from external upper ends of the elements towards the periphery of the casing and the internal lower end of the elements are connected to at least one electrical connection track provided on the support via a metal hybridization ball.
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