Method of affixing a heat sink to a substrate and package thereof
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United States of America Patent
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Jan 13, 2004
Grant Date -
May 29, 2003
app pub date -
Jun 3, 2002
filing date -
Nov 29, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of affixing a heat sink to a substrate and package thereof having a substrate with a position for receiving a semiconductor chip, at least a semiconductor chip for affixing on the position and electrically connecting the substrate, an appropriate thickness of adhesive agent by scraping by means of screen printing technology, a heat sink for covering the semiconductor chip and provided with a plurality of dimples for affixing to the substrate, the method including steps of affixing the semiconductor to the substrate and utilizing a scraper to apply a layer of adhesive agent with an appropriate thickness of adhesive on a platform from the adhesive agent; utilizing a sucker to move the heat sink to a position above the layer of adhesive agent, and dipping the dimples of the heat sink into the adhesive layer so as to adhere some adhesive agent onto the dimples, and then moving the heat sink above the semiconductor chip; affixing the heat sink to the substrate to cover the semiconductor chip; and enclosing the heat sink with epoxy resin to form a package.
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