Device for integrally joining a metal block that can be made up of plates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 13, 2004
Grant Date -
N/A
app pub date -
Dec 24, 2001
filing date -
Jun 30, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device for integrally joining a metal block (11') that can consist of a number of plates, by hard-soldering or brazing. The hard-solder provides a connection covering a large surface and with a minimal thickness in solder gaps (17.sub.j ; j=1, 2, . . . , n-1) located between adjacent segment plates (12.sub.i ; i=1, 2, . . . , n). At least one capillary solder inflow path (14) is provided. Said solder inflow path starts at a solder depot containing a supply of hard solder or braze material (42), which melts as the stack (11) of plates is heated. The melted solder material flows directly to the individual, also capillary solder gaps (17.sub.j ; j=1, 2, . . . , n-1) via said solder inflow path, the solder gaps being provided between surfaces of the segment plates (12i) that face towards each other.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully