Solder paste stenciling apparatus for minimizing residue of solder paste
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 13, 2004
Grant Date -
Sep 11, 2003
app pub date -
Mar 6, 2002
filing date -
Mar 6, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solder paste stenciling apparatus for minimizing residue of solder paste includes a stencil having multiple stencil openings defined therein, a supporting member retaining the stencil, and a vibrator for vibrating the stencil. In operation, a substrate is engaged to a bottom surface of the stencil, and solder paste is applied onto a top surface of the stencil so that the stencil openings are filled with the solder paste. The substrate is then slowly separated from the stencil while the vibrator vibrates the stencil to evacuate the solder paste out of the stencil openings and to further deposit on the substrate. Hence, the amount of residual solder paste adhered to inner surfaces defining the stencil openings is minimized.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully