Grounding terminal and mounting structure of the same on a printed circuit board
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United States of America Patent
Stats
-
Jan 6, 2004
Grant Date -
May 9, 2002
app pub date -
Sep 13, 2001
filing date -
Apr 30, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.
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