Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
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United States of America Patent
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Jan 6, 2004
Grant Date -
N/A
app pub date -
Aug 29, 2000
filing date -
Sep 9, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.
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