Resonator for ultrasonic wire bonding
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 30, 2003
Grant Date -
Jan 9, 2003
app pub date -
Jul 3, 2002
filing date -
Jul 6, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The bonding position between a bonding wire and an electrode is maintained accurately, an ultrasonic horn is mounted to a bonding machine by the attachment portions of support portions situated at minimum vibration amplitude points equally distant from a capillary in opposite directions in such a manner that it is supported on both sides, and the ultrasonic horn, capillary and bonding work portion are vibrated by ultrasonic waves to bond the end portion of the bonding wire.
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